Quectel SE200ZC-AP smart module supports up to five cameras with Rockchip RV1126B/BJ SoC

Quectel has launched the SE200ZC-AP, a compact (40 x 40 mm) smart module based on the Rockchip RV1126B/RV1126BJ quad-core Arm Cortex-A53 SoC with a 12MP ISP, an 8MP AI-ISP, and a 3 TOPS NPU. The module supports up to five 12MP cameras through two 4-lane MIPI CSI interfaces and one DVP interface. Other interfaces include Gigabit Ethernet, USB 3.0/2.0, two CAN FD, up to eight UART, six I2C, two SPI, two SDIO, three SAI, 22 ADC, 28 PWM, and up to 115 GPIOs. It ships with 1GB, 2GB, or 4GB LPDDR4x and 64GB eMMC flash, and is available in commercial and industrial grades, with operating temperatures of -25°C to +75°C and -35°C to +80°C, respectively.  These features make it suitable for smart security, industrial automation, autonomous vehicles, robotic vision, and Smart Home applications. Quectel SE200ZC-AP specifications: SoC – Rockchip RV1126B or RV1126BJ (industrial-grade version) CPU – Quad-core Arm Cortex-A53 up [...]

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